Dissipating heat from an active region of an optical device

ABSTRACT

A device, such as an electroabsorption modulator, can modulate a light intensity by controllably absorbing a selectable fraction of the light. The device can include a substrate. A waveguide positioned on the substrate can guide light. An active region positioned on the waveguide can receive guided light from the waveguide, absorb a fraction of the received light, and return a complementary fraction of the received light to the waveguide. Such absorption produces heat, mostly at an input portion of the active region. The input portion of the active region can be thermally coupled to the substrate, which can dissipate heat from the input portion, and can help avoid thermal runaway of the device. The active region can be thermally isolated from the substrate away from the input portion, which can maintain a relatively low thermal mass for the active region, and can increase efficiency when heating the active region.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/685,374, filed Aug. 24, 2017, which claims the benefit of U.S.Provisional Application No. 62/413,077, filed on Oct. 26, 2016, thecontents of which are incorporated by reference herein in theirentirety.

TECHNICAL FIELD

The present disclosure relates to controllably dissipating heat in anactive region of an optical device.

BACKGROUND

A device, such as an electroabsorption modulator, can modulate a lightintensity by controllably absorbing a selectable fraction of the light.Such absorption can produce heat. It is desirable to dissipate heatcaused by the light absorption.

BRIEF DESCRIPTION OF THE DRAWINGS

In the following detailed description of example embodiments of theinvention, reference is made to the accompanying drawings which form apart hereof, and which is shown by way of illustration only, specificembodiments in which the invention may be practiced. It is to beunderstood that other embodiments may be utilized and structural changesmay be made without departing from the scope of the present invention.

FIG. 1 shows a cross-section of an example of a device, in which lightpropagates within the plane of the figure, in accordance with someembodiments.

FIG. 2 shows another cross-section of the device of FIG. 1, where lightpropagates into or out of the plane of the figure, in accordance withsome embodiments.

FIG. 3 shows an exploded view of the waveguide and the active region ofFIGS. 1 and 2, in accordance with some embodiments.

FIG. 4 shows a cross-sectional view of the active region of FIGS. 1-3,in accordance with some embodiments.

FIG. 5 shows a cross-section view of the waveguide of FIGS. 1-3, inaccordance with some embodiments.

FIG. 6 shows an example of a method for dissipating heat from an activeregion of an optical device, in accordance with some embodiments.

Corresponding reference characters indicate corresponding partsthroughout the several views. Elements in the drawings are notnecessarily drawn to scale. The configurations shown in the drawings aremerely examples, and should not be construed as limiting the scope ofthe invention in any manner.

DETAILED DESCRIPTION

A device, such as an electroabsorption modulator, can modulate a lightintensity by controllably absorbing a selectable fraction of the light.In a typical, known configuration of an electroabsorption modulator, anactive region can absorb a particular percentage of the light per unitlength of the active region. As a result, the known device can show arelatively large absorption near an input portion of the active region,which can decrease to a relatively small absorption near an outputportion of the active region.

The active region generates heat where the absorption occurs.Consequently, because the input portion of the active region absorbs themost light, the input portion produces most of the heat generated by theactive region.

To further complicate use of the known electroabsorption modulator, theactive region may be formed from a material that increases absorption asthe temperature increases. As a result, the input portion of the activeregion can absorb even more light, and increase its temperature evenmore. In some instance, this can lead to thermal runaway of theelectroabsorption modulator, which is undesirable and can damage theactive region and other components in the electroabsorption modulator.

One solution for dissipating the heat from the active region is tothermally couple the full active region to a heat sink, such as asubstrate that can dissipate the heat over a relatively large area. Adrawback to heat sinking the full active region is that it can increasea thermal mass of the active region. Such an increase in thermal masscan make it more difficult to change the temperature of the activeregion. For an electroabsorption modulator that uses a heater tocontrollably change the temperature, the increase in thermal mass canresult in slower performance for a given heater, or can require use of amore powerful heater to maintain a particular modulator speed. Both ofthese cases are undesirable.

A better solution is to dissipate the heat produced in the input portionof the active region, where most of the heat is generated, whilethermally isolating the remainder of the active region. In such asolution, the input portion of the active region can be thermallycoupled to the substrate, which can dissipate heat from the inputportion, and can help avoid thermal runaway of the device. Furthermore,in such a solution, the active region can be thermally isolated from thesubstrate away from the input portion, which can maintain a relativelylow thermal mass for the active region, and can increase efficiency whenheating the active region. The discussion that follows includes severalmechanisms for dissipating the heat in just the input portion of theactive region.

One example of a device, such as an electroabsorption modulator, caninclude a substrate. A waveguide can be positioned on the substrate andcan guide light. An active region can be positioned on the waveguide andcan receive guided light from the waveguide, absorb a fraction of thereceived light, and return a complementary fraction of the receivedlight to the waveguide. The active region can include an input portionthat can receive the guided light. The active region can be thermallycoupled to the substrate in the input portion and can be thermallyisolated from the substrate away from the input portion.

In some examples, the device can use air as a thermal insulator, and canuse one or more particular etched portions of the substrate to providethermal isolation from the substrate material. For these examples, thesubstrate can be etched to form an etched portion. The etched portioncan extend under the waveguide from the input portion of the activeregion to an output end of the active region such that the etchedportion thermally isolates the active region from the substrate. Theetched portion of the substrate may not extend under the input portionof the active region such that the active region is thermally coupled tothe substrate in the input portion.

The preceding paragraphs are merely a summary of the subject matter thatfollows, and should be not be construed as limiting in any way. Thefollowing discussion provides additional details regardingconfigurations of the device.

FIG. 1 shows a cross-section of an example of a device 100, in whichlight propagates within the plane of the figure, in accordance with someembodiments. FIG. 2 shows another cross-section of the device 100 ofFIG. 1, where light propagates into or out of the plane of the figure,in accordance with some embodiments. In some examples, the device 100can function as an electroabsorption modulator. This is but oneconfiguration of such a device; other configurations can also be used.

The device 100 can include a substrate 102. The substrate 102 can beformed from silicon, from a III-V semiconductor material, or from anyother suitable material. In some examples, the device 100 can be formedusing semiconductor techniques to deposit or grow the various elementsas layers on the substrate 102. In the cross-sectional views of FIGS. 1and 2, the substrate 102 is shown toward the bottom of the figures, andadditional layers or elements are shown above the substrate 102. For thepurposes of this document, the additional layers or elements arereferred to as being “on” the substrate 102 or “under” particularstructures, such as waveguides. Such a designation is used forconvenience, and is not intended to imply that the device 100 or any ofits elements have a particular orientation during manufacturing,storage, or use.

In addition, in the cross-sectional view of FIG. 1, light travelsgenerally from left to right as it propagates through the device 100.For the purposes of this document, the directions shown in the figuresare pictured in this manner strictly for convenience. The figures arenot intended to imply that light in the device 100 travels along aparticular direction during use.

A waveguide 104 can be positioned on the substrate 102 and can guidelight. In some examples, the waveguide 104 can be formed as a siliconpath or trench within a layered structure. The silicon path or trenchcan be surrounded by one or more non-silicon materials in the layeredstructure, so that light remains confined within the waveguide 104. Thesilicon path or trench can have a cross-sectional shape suitable forpropagating light.

An active region 106 can be positioned on the waveguide 104. The activeregion 106 can receive guided light from the waveguide 104, can absorb afirst fraction of the received light, and can return a second fractionof the received light to the waveguide 104. In some examples, the firstfraction and the second fraction can be complementary, so that the firstand second fractions sum to 100%, or can sum to a value less than 100%.In some examples, the active region 106 can include a III-Vsemiconductor material having an absorption spectrum that is variable inresponse to applied heat and an applied electric field. In someexamples, the III-V semiconductor material can use one of thequantum-confined Stark effect or the Franz-Keldysh effect. In someexamples, an absorption of the III-V semiconductor material can increasewith increasing temperature.

FIG. 3 shows an exploded view of the waveguide 104 and the active region106 of FIGS. 1 and 2, in accordance with some embodiments. FIG. 4 showsa cross-sectional view of the active region 106 of FIGS. 1-3, inaccordance with some embodiments. FIG. 5 shows a cross-section view ofthe waveguide 104 of FIGS. 1-3, in accordance with some embodiments.FIGS. 3-5 are intended to complement and clarify the geometry of thewaveguide 104 and the active region 106 shown in FIGS. 1 and 2.

The waveguide 104 can taper to a narrowed portion 302 at a first taper304 and can widen from the narrowed portion 302 at a second taper 306.In some examples, the active region 106 can be parallel to and adjacentthe narrowed portion 302. The active region 106 can receive guided lightfrom the waveguide 104 at the first taper 304. The active region 106 canabsorb a fraction of the received light as the light propagates alongthe active region 106. The absorption (and therefore, the generatedheat) can decrease from an input end 308 of the active region 106 to anoutput end 310 of the active region 106. The active region 106 canreturn a complementary fraction of the received light to the waveguide104 at the second taper 306.

The geometry of FIGS. 3-5 is intended to show a general behavior oflight propagating through the waveguide 104 and the active region 106,where light propagates from the waveguide 104 to the active region 106,then returns to the waveguide 104. There are additional configurationsdiscussed below, in which one or more specific portions of the waveguide104 and/or the active region 106 can be varied in size, shape, and/orrelative orientation. The present discussion below returns to FIG. 1.

The active region 106 can include an input portion 108 that can receivethe guided light. The active region 106 can be thermally coupled to thesubstrate 102 in the input portion 108 and can be thermally isolatedfrom the substrate 102 away from the input portion 108.

In some examples, the device 100 can use air to perform thermalisolation, because air has a thermal conductivity less than the thermalconductivity of most solid materials. For example, the substrate 102 canbe etched to form an etched portion 110. The etched portion 110 canextend under the waveguide 104 from the input portion 108 of the activeregion 106 to an output end 112 of the active region 106 such that theetched portion 110 can thermally isolate the active region 106 from thesubstrate 102. The etched portion 110 of the substrate 102 may notextend under the input portion 108 of the active region 106 such thatthe active region 106 is thermally coupled to the substrate 102 in theinput portion 108. In some examples, the etched portion 110 can bedesigned in a way that tailors a thermal impedance (e.g. a degree ofthermal isolation) along a length of the device. For example, a front ofthe device can include a narrower region of etching, and the etching canwiden along a length of the device. In another example, an overlap ofthe etched portion 110 with a ridge can vary along a length the device.In some examples, a spacing between a heater and the modulator can alsovary along a length of the device. Other techniques to dissipate heatcan also be used, in addition to or instead of the etching shown in FIG.1.

In some examples, a heater 202 (FIG. 2) can selectively heat the activeregion 106. In some examples, heat from the heater 202 can controllablyvary the absorption spectrum of the III-V semiconductor material in theactive region 106. In some examples, the heater 202 can be anelectrically resistive heater. In some examples, the heater 202 can beelectrically connected to control circuitry 208 (FIG. 2), which cansupply a controllable current to the electrically resistive heater toselectively heat the active region 106. The control circuitry mayinclude one or more hardware processors.

In some examples, a plurality of electrodes 114 can produce an electricfield in the active region 106. In some examples, the electric fieldfrom the electrodes 114 can controllably vary the absorption spectrum ofthe III-V semiconductor material in the active region 106. In someexamples, the electrodes 114 can be electrically connected to thecontrol circuitry 208, which can supply a selectable voltage to theplurality of electrodes 114 to control a strength of the electric fieldin the active region 106.

In some examples, the electrodes 114 and the heater 202 can worktogether to controllably vary the absorption spectrum of the III-Vsemiconductor material in the active region 106. In some examples, theelectrodes 114 can vary the electric field more rapidly than the heater202 can vary the temperature, so that the heater 202 can vary theabsorption spectrum at relatively low frequencies, while the electrodes114 can vary the absorption spectrum at relatively high frequencies.

In some examples, the control circuitry 208 can be positioned away fromthe device 100, and can connect to the device 100 through an interfacethat electrically connects to the electrodes 114 and connects tocorresponding electrodes for the heater 202 (not shown).

In some examples, an optional buried oxide layer 116 can be positionedbetween the substrate 102 and the waveguide 104. The buried oxide layer116 has a low refractive index relative to silicon and can serve ascladding for an optical mode in the waveguide 104. In some examples, theburied oxide layer 116 can also serve as an etch stop layer for asubstrate etch. In some examples, the etched portion 110 of thesubstrate 102 may extend partially or fully through the buried oxidelayer 116. In other examples, the etched portion 110 of the substrate102 may extend only partially through the substrate 102, and may notreach the buried oxide layer 116.

In some examples, a cladding layer 118 can be formed from a dielectricmaterial, can be positioned directly adjacent the waveguide 104 and theactive region 106, and can surround the heater 202.

The following six paragraphs describe additional techniques that canhelp reduce the risk of damaging the input portion 108 of the activeregion 106 due to excessive heating. Some of the techniques reduce theamount of light absorbed at the input portion 108, compared with theremainder of the active region 106. Some of the techniques helpdissipate the heat generated at the input portion 108 of the activeregion 106. One of ordinary skill in the art will readily understandthese additional techniques from the description below, without the needfor additional drawings. All of these additional techniques can be usedalone or in any combination. Any and all can optionally be used inaddition to or instead of the etching technique discussed above.

In some examples, the control circuitry and electrodes 114 can furtherprovide a first electric field in the input portion 108 of the activeregion 106 and provide a second electric field, greater than the firstelectric field, in the active region 106 away from the input portion 108of the active region 106. Reducing the electric field in the inputportion 108 can decrease the fraction of light absorbed in the inputportion 108, compared to the fraction of light absorbed in the remainderof the input portion 108. This can allow for an increase in the totalamount of light absorbed by the active region 106, without damaging theinput portion 108 of the active region 106. Alternatively, the electricfield in the input portion 108 can be reduced by performing ionimplantation to change the doping junction thickness profile along thedevice 100. For example, fluorine ions can be used to deactivate silicondoping of InAlGaAs. As a further alternative, resistance can be added tothe electrical path, although adding resistance can slow downperformance of the device 100.

In some examples, the active region 106 can extend beyond the narrowedportion 302 to at least partially overlap with the first taper 304.Overlapping the first taper 304 in this manner can reduce the amount oflight present in the input portion 108. This can decrease the fractionof light absorbed in the input portion 108, compared to the fraction oflight absorbed in the remainder of the input portion 108. This can allowfor an increase in the total amount of light absorbed by the activeregion 106, without damaging the input portion 108 of the active region106.

In some examples, at least one of the plurality of electrodes 114 can besegmented proximate the input portion 108 of the active region 106. Thiscan reduce the electric field in the input portion 108, compared to theremainder of the active region 106. Reducing the electric field in theinput portion 108 can decrease the fraction of light absorbed in theinput portion 108, compared to the fraction of light absorbed in theremainder of the input portion 108. This can allow for an increase inthe total amount of light absorbed by the active region 106, withoutdamaging the input portion 108 of the active region 106. Further,combining the segmented electrodes 114 with extension of the activeregion 106 into the first taper 304 can be particularly advantageous.Doing so can allow the input portion 108 of the active region 106 tohave a lower confinement factor than the remainder of the active region106. Doing so can also reduce the increase in capacitance that would becaused by extending the active region 106 over the first taper 304 in asingle segment.

In some examples, the device 100 can further include at least onesilicon rib 204 (FIG. 2) oriented parallel to the active region 106 andpositioned between the active region 106 and the etched portion 110 ofthe substrate 102. Such a silicon rib 204 can conduct heat efficientlyalong the active region 106, and can redistribute heat away from theinput portion 108 to the remainder of the active region 106. The atleast one silicon rib 204 can have a cross-sectional size that issmaller than a wavelength of the guided light. Using such a small rib204 can ensure that the rib does not affect an optical performance ofthe active region 106. Specifically, using such a small rib 204 can maynot appreciably affect a confinement of the light within the activeregion 106. The silicon rib 204 can be formed by etching trenches 206 inthe silicon waveguide 104 on either side of the rib 204, then fillingthe trenches 206 with a dielectric material. The active region 106 canbe formed directly on the silicon rib 204 and the filled trenches 206.

In some examples, the device 100 can further include a metallic thermalshunt positioned at least partially on the input portion of the activeregion. Such a metallic thermal shunt can conduct heat efficiently awayfrom the input portion 108 of the active region 106. This can enhancethe heat dissipation provided by the overlap of the substrate 102 withthe input portion 108 of the active region 106.

In some examples, the active region 106 can have a cross-sectional sizethat is larger at the input portion 108 of the active region 106 thanthe output end 112 of the active region 106. Expanding the size of theinput portion 108 can decrease the peak power dissipation per unitvolume at the input portion 108, which can help prevent damage to theinput portion 108.

The preceding six paragraphs describe additional techniques that canhelp reduce the risk of damaging the input portion 108 of the activeregion 106 due to excessive heating. Any and all can optionally be usedalone, in any combination with one another, or in addition to or insteadof the etching technique discussed above.

FIG. 6 shows an example of a method 600 for dissipating heat from anactive region of an optical device, in accordance with some embodiments.The method 600 can be executed on the device 100 shown in FIGS. 1 and 2,which can optionally include any or all of the additional techniquesdescribed above for reducing the risk of damaging the input portion ofthe active region due to excessive heating. This is but one method fordissipating heat from an active region of an optical device; othersuitable methods can also be used.

At operation 602, the device can guide light from a waveguide into aninput portion of an active region of an optical device. The waveguideand the active region can be positioned on a substrate. The activeregion can be thermally coupled to the substrate at the input portionand thermally isolated from the substrate away from the input portion.

At operation 604, the device can absorb a fraction of the input light inthe active region.

At operation 606, the device can return a portion of the light to thewaveguide.

In some examples, the substrate can be etched to form an etched portion.In some examples, the etched portion can extend under the waveguide fromthe input portion of the active region to an output end of the activeregion, such that the etched portion thermally isolates the activeregion from the substrate. In some examples, the etched portion of thesubstrate may not extend under the input portion of the active region,such that the waveguide is thermally coupled to the active region at theinput portion.

In some examples, the method 600 can further include heating the activeregion with a heater controlled by control circuitry.

In some examples, the method 600 can further include producing anelectric field in the active region with the control circuitry and aplurality of electrodes.

To further illustrate the device and related method disclosed herein, anon-limiting list of examples is provided below. Each of the followingnon-limiting examples can stand on its own, or can be combined in anypermutation or combination with any one or more of the other examples.

In Example 1, an optical device can include a substrate; a waveguidepositioned on the substrate and configured to guide light; and an activeregion positioned on the waveguide and including an input portion thatis configured to receive guided light from the waveguide, the activeregion configured to absorb a first fraction of the received light andreturn a second fraction of the received light to the waveguide, theactive region being thermally coupled to the substrate at the inputportion and thermally isolated from the substrate away from the inputportion.

In Example 2, the optical device of Example 1 can optionally beconfigured such that the substrate is etched to form an etched portion;the etched portion extends under the waveguide from the input portion ofthe active region to an output end of the active region such that theetched portion thermally isolates the active region from the substrate;and the etched portion of the substrate does not extend under the inputportion of the active region such that the active region is thermallycoupled to the substrate at the input portion.

In Example 3, the optical device of any one of Examples 1-2 canoptionally further include a heater configured to heat the activeregion; a plurality of electrodes configured to produce an electricfield in the active region; and control circuitry configured to controlthe heater to selectively heat the active region, and supply aselectable voltage to the plurality of electrodes to control a strengthof the electric field in the active region.

In Example 4, the optical device of any one of Examples 1-3 canoptionally be configured such that the active region includes a III-Vsemiconductor material having an absorption spectrum that is variable inresponse to the heat from the heater and to the electric field from theelectrodes; the III-V semiconductor material uses one of thequantum-confined Stark effect or the Franz-Keldysh effect; and anabsorption of the III-V semiconductor material increases with increasingtemperature.

In Example 5, the optical device of any one of Examples 1-4 canoptionally be configured such that the control circuitry and electrodesare further configured to provide a first electric field in the inputportion of the active region and provide a second electric field,greater than the first electric field, in the active region away fromthe input portion of the active region.

In Example 6, the optical device of any one of Examples 1-5 canoptionally be configured such that the waveguide tapers to a narrowedportion at a first taper and widens from the narrowed portion at asecond taper; the active region is parallel to and adjacent the narrowedportion; and the active region extends beyond the narrowed portion to atleast partially overlap with the first taper.

In Example 7, the optical device of any one of Examples 1-6 canoptionally further include at least one of the plurality of electrodesis segmented proximate the input portion of the active region.

In Example 8, the optical device of any one of Examples 1-7 canoptionally further include at least one silicon rib oriented parallel tothe active region and positioned between the active region and theetched portion of the substrate, the at least one silicon rib having across-sectional size that is smaller than a wavelength of the guidedlight.

In Example 9, the optical device of any one of Examples 1-8 canoptionally further include a metallic thermal shunt positioned at leastpartially on the input portion of the active region.

In Example 10, the optical device of any one of Examples 1-9 canoptionally be configured such that the active region has across-sectional size that is larger at the input portion of the activeregion than at an output end of the active region.

In Example 11, the optical device of any one of Examples 1-10 canoptionally further include a buried oxide layer positioned between thesubstrate and the waveguide; and a cladding layer formed from adielectric material, positioned directly adjacent the waveguide and theactive region, and surrounding the heater.

In Example 12, a method can include guiding light from a waveguide intoan input portion of an active region of an optical device, the waveguideand the active region positioned on a substrate, the active region beingthermally coupled to the substrate at the input portion and thermallyisolated from the substrate away from the input portion; absorbing afraction of the input light in the active region; and returning aportion of the light to the waveguide.

In Example 13, the method of Example 12 can optionally be configuredsuch that the substrate is etched to form an etched portion; the etchedportion extends under the waveguide from the input portion of the activeregion to an output end of the active region, such that the etchedportion thermally isolates the active region from the substrate; and theetched portion of the substrate does not extend under the input portionof the active region, such that the waveguide is thermally coupled tothe active region at the input portion.

In Example 14, the method of any one of Examples 12-13 can optionallyfurther include heating the active region with a heater controlled bycontrol circuitry.

In Example 15, the method of any one of Examples 12-14 can optionallyfurther include producing an electric field in the active region withthe control circuitry and a plurality of electrodes.

In Example 16, an optical device can include a substrate; a waveguidepositioned on the substrate and configured to guide light, the waveguidetapering to a narrowed portion at a first taper and widening from thenarrowed portion at a second taper; a buried oxide layer positionedbetween the substrate and the waveguide; and an active region positionedon the waveguide and including an input portion that is configured toreceive guided light from the waveguide at the first taper, the activeregion configured to absorb a first fraction of the received light andreturn a second fraction of the received light to the waveguide at thesecond taper, the substrate being etched to form an etched portion, theetched portion extending under the waveguide from the input portion ofthe active region to an output end of the active region such that theetched portion thermally isolates the active region from the substrateaway from the input portion, the etched portion of the substrate notextending under the input portion of the active region such that theactive region is thermally coupled to the substrate at the inputportion.

In Example 17, the optical device of Example 16 can optionally furtherinclude a heater configured to heat the active region; a plurality ofelectrodes configured to produce an electric field in the active region;and control circuitry configured to control the heater to selectivelyheat the active region, and supply a selectable voltage to the pluralityof electrodes to control a strength of the electric field in the activeregion.

In Example 18, the optical device of any one of Examples 16-17 canoptionally further include a cladding layer formed from a dielectricmaterial, positioned directly adjacent the waveguide and the activeregion, and surrounding the heater.

In Example 19, the optical device of any one of Examples 16-18 canoptionally be configured such that the active region includes a III-Vsemiconductor material having an absorption spectrum that is variable inresponse to applied heat and to the electric field from the electrodes;the III-V semiconductor material uses one of the quantum-confined Starkeffect or the Franz-Keldysh effect; and an absorption of the III-Vsemiconductor material increases with increasing temperature.

In Example 20, the optical device of any one of Examples 16-19 canoptionally be configured such that the control circuitry and electrodesare further configured to provide a first electric field in the inputportion of the active region and provide a second electric field,greater than the first electric field, in the active region away fromthe input portion of the active region.

What is claimed is:
 1. An optical device, comprising: a substrate layercomprising an etched portion; a waveguide layer on the substrate layer,the waveguide layer including a waveguide to guide light; and an activeregion on the waveguide layer and including an input portion to receiveguided light from the waveguide, the etched portion extending under thewaveguide from the input portion of the active region to an output endof the active region to thermally isolate the active region from thesubstrate layer, and the etched portion of the substrate layer notextending under the input portion of the active region such that theactive region is thermally coupled to the substrate layer at the inputportion.
 2. The optical device of claim 1, wherein the optical devicecomprises an oxide layer between the waveguide layer and the substratelayer.
 3. The optical device of claim 1, wherein the active region thatis distal from the input portion is outside the input portion.
 4. Theoptical device of claim 1, further comprising: a heater configured toheat the active region.
 5. The optical device of claim 4, furthercomprising: a plurality of electrodes to produce an electric field inthe active region.
 6. The optical device of claim 5, further comprising:control circuitry to control the heater to heat the active region. 7.The optical device of claim 6, wherein the control circuitry controls asupply of voltage to the plurality of electrodes to control a strengthof the electric field in the active region.
 8. The optical device ofclaim 6, wherein the active region includes a III-V semiconductormaterial having an absorption spectrum that varies in response to heatfrom the heater and the electric field from the plurality of electrodes.9. The optical device of claim 8, wherein an absorption of the III-Vsemiconductor material increases with increasing temperature.
 10. Theoptical device of claim 6, wherein the control circuitry and theplurality of electrodes provide a first electric field in the inputportion of the active region and provide a second electric field,greater than the first electric field, in the active region distal fromthe input portion of the active region.
 11. The optical device of claim1, wherein the waveguide tapers to a narrowed portion at a first taperand widens from the narrowed portion at a second taper.
 12. The opticaldevice of claim 11, wherein the active region is parallel to andadjacent the narrowed portion.
 13. The optical device of claim 12,wherein the active region extends beyond the narrowed portion topartially overlap with the first taper.
 14. The optical device of claim5, wherein at least one of the plurality of electrodes is segmentedproximate the input portion of the active region.
 15. The optical deviceof claim 1, further comprising at least one silicon rib orientedparallel to the active region and positioned between the active regionand the etched portion of the substrate layer, the at least one siliconrib having a cross-sectional size that is smaller than a wavelength ofthe guided light.
 16. A method, comprising: guiding light in a waveguideof a waveguide layer of an optical device; inputting the light to aninput portion of an active region of the optical device, the waveguidelayer and the active region positioned on a substrate layer of theoptical device, the substrate layer comprising an etched portion, theactive region being thermally coupled to the substrate layer at theinput portion and thermally isolated from the substrate layer distalfrom the input portion, the etched portion extending under the waveguidefrom the input portion of the active region to an output end of theactive region to thermally isolate the active region from the substratelayer, and the etched portion of the substrate layer not extending underthe input portion of the active region such that the active region isthermally coupled to the substrate layer at the input portion; andabsorbing a portion of the light by the active region.
 17. The method ofclaim 16, wherein the optical device comprises an oxide layer betweenthe waveguide layer and the substrate layer.
 18. The method of claim 16,wherein the active region that is distal from the input portion isoutside the input portion.
 19. The method of claim 16, furthercomprising: heating the active region with a heater of the opticaldevice.